Congratulations to Ali Jishi on being awarded U.S. Patent #11971226 for a "High-Temperature Thermal Dual-Barrier Coating." This significant achievement is a testament to the innovative research and hard work happening within our group.
The newly patented technology describes a sophisticated thermal dual-barrier coating system. It uniquely integrates a first thermal barrier layer with a distinct thermal conductivity, coupled with one or more composite structures positioned vertically. These composites are key, incorporating an ultra-thin disordered semi-continuous metallic film alongside a layer of a second thermal barrier material, designed to optimize thermal performance.
The patent was officially awarded on May 20, 2024, with crucial support from the Purdue Research Foundation’s Office of Technology Commercialization (OTC). We extend our congratulations to Ali on this significant milestone and are excited about the potential applications of this cutting-edge technology.
